General Co-Chairs

  • Kang Lee, National Institute of Standards and Technology
  • Stefano Ruffini,Ericsson

Technical Program Co-Chairs

  • Radim Bartos, University of New Hampshire
  • Lee Cosart, Microsemi

contact: ispcs@iiss.at


Plugfest Committee

  • Douglas Arnold (Co-Chair), Meinberg USA
  • Ken Harris (Co-Chair), Rockwell Automation
  • Heiko Gerstung, Meinberg
  • Ken Harris, Rockwell Automation
  • Jeff Laird, UNH-IOL
  • Judy Zhu, Kyland
  • Timo Koskiahde, Flexibilis
  • Denis Reilly, Spectracom

contact: ispcs-plugfest@iiss.at


Local Arrangements Co-Chairs

  • David Broman, KTH Royal Institute of Technology
  • Mikael Johansson, Ericsson
  • Neiva Lindqvist, Ericsson

contact: ispcs@iiss.at


Promotional Partners Co-Chairs

  • Hans Weibel, Zurich University of Applied Sciences
  • Zhaofeng Zhang, Zhongguancun gongkong Advanced Manufacturing Industry Alliance

contact: ispcs@iiss.at


Program Committee

  • Douglas Arnold, Meinberg USA
  • Zdenek Chaloupka, Etisalat, Khalifa University
  • Greg Dowd, Microsemi
  • Pedro Estrela, IMC Financial Markets
  • Reinhard Exel, Austrian Academy of Sciences
  • Paolo Ferrari, University of Brescia
  • Geoffrey Garner, Consultant
  • Sulaiman Hussaini, University of Michigan
  • Sebastien Jobert, Google
  • Nikolaus Kerö, Oregano Systems
  • Hubert Kirrmann, ABB Switzerland
  • David Macii, University of Trento
  • John MacKay, Progeny Systems
  • Cristian Marinescu, Omicron
  • Peter Meyer, Microsemi
  • Tal Mizrahi, Marvell
  • Laurent Montini, Cisco
  • Claudio Narduzzi, University of Padova
  • Peter Roberts, Alcatel Lucent
  • David Roe, Semtech
  • Opher Ronen, Oscilloquartz, an ADVA Optical Networking company
  • Stefano Rinaldi, University of Brescia
  • Silvana Rodrigues, Integrated Device Technology
  • Sebastian Schriegel, Fraunhofer
  • Karim Traore, Microsemi
  • Hans Weibel, Zurich University of Applied Sciences